Year come, the chip that fold a layer encloses the main trend that makes technical progress gradually. The chip that fold a layer encloses a technology, abbreviation 3D is enclosed, it is to point to changing the premise that encloses body dimension to fall, in same enclose those who put two above chip is fold to enclose a technology at perpendicular direction inside body, its traceable shows memory quickly (of NOR/NAND) and SDRAM fold a layer to enclose.
The chip that fold a layer encloses a technology to reach memory card to tell to wireless communication parts of an apparatus, portable parts of an apparatus is optimal system solution. In recent years, the technical development of the consumer goods such as mobile phone, PDA, computer, communication, number is very rapid, all sorts of semiconductor device such as the memory of the high capacity of need of swift and violent development of visit course of study, muti_function, small size, low cost, DSP, ASIC, RF, MEMS, technology of the chip that fold a layer also got developing flourishingly accordingly.
3D encloses main characteristic of the technology to include: Muti_function, tall efficiency; High capacity high density is spent, the function on unit volume reachs applied twice promotion and low cost. In NAND enclose formally, although develop,the fastest is SIP, but a when TSOP remains high capacity NAND to enclose main solution. Compare with SIP photograph, TSOP has flexibility more, because TSOP can pass SMD to make SD,be compositive wait for different terminal product to MP3/MP4, mobile memory in, and once SIP is finished assemble, it is finished product, cannot undertake adjustment again according to market demand. The PBGA that can assemble through SMD likewise with another kind encloses formal photograph to compare, TSOP has very clear cost advantage.
TSOP folds layer chip to enclose a technology
Technological process of production of odd chip TSOP is simpler, need to be stuck through only piece, bond of roast, down-lead is OK, if flow pursues 1:
We can identify according to enclosing a name there is how many chip in folding a chip to enclose. For instance, "TSOP2 1 " show a TSOP is enclosed namely there are two active chips inside body (an ActiveDie) , blank chip (Spacer) , if we say " TSOP3 0 " , a TSOP encloses that that is to say there are 3 active chips inside body, without blank chip, with this analogize.
Graph 2 be the most typical TSOP2 1 enclose formal section plane and vertical view, fluctuation is truly effective chip two (ActiveDie) , among one is to want to solder to rock-bottom chip put apart space and affiliation blank chip (Spacer) . Blank chip (Spacer) is made by silicon chip, there is circuit inside.
