Semiconductor industry has entered 65 accept rice and period of the following technology at present, crucial feature is accept rice class normally, the measuring instrument with the workmanship special requirement of so small feature implement | Appearance, so that can dimension of geometry of class of token cashier rice, examine thereby the case that gives values of any center of deviate technology standards, ensure with the design norms keeps consistent.
Scanning bougie microscope (SPM) has applied in accept rice technology and accept rice science, basically include to wait for the research that is a foundation and industrial application with appearance of structure, mechanical, magnetic, form, electricity, chemical, biology, project. Nuclear power microscope (AFM) is with microscopical a the SPM that force induction is a foundation is familial ramose. Industrial AFM is one kind automatic, measure machine stage by the online production of menu drive, operation of automatic silicon chip operation, alignment, bougie, position is searched, catch graph and image data analysis to wait measure be by process designing in menu, final output measures data. Be worth what carry is, AFM reachs the token in node of the following technology to engrave corrode and chemical and mechanical polish as 130 accept rice (the method of advanced geometry control that the dimension of CMP) measures has been applied extensively at semiconductor manufacturing industry, as similar as semiconductor industry engineering technology, the industry that film of smooth attack by surprise and film give priority to also used AFM to regard craft as measurement technique.
AFM can measure dimension of exterior form appearance, 3D and geometrical appearance, horizontal surface outline and outline of perpendicular sidewall appearance. Measure area to be able to be in very small (<50 μ M) or very long (inside the limits of <10cm) . Use pattern of small proportion AFM, measureable variable has height or deepness, line outline of surface roughness of angle of surface roughness of brim of broad change of wide, line, line, span, sidewall, sidewall, cross section, with exterior surface roughness. Growing limits (Profiler mode) , AFM is used at CMP craft the measurement of outline of appearance of overall appearance form.
The advantage that AFM measures
Divide AFM beyond, SEM(X-SEM) of CDSEM, cross section, TEM, DualBeam, optical scattering is measured, optical contourgraph and bougie contourgraph all are already the measurement technique of some token and monitoring technology measure. The method of 3D dimension analysis that thinks to deserve credit most normally should be X-SEM or TEM, but the main obstacle of X-SEM or TEM is operation of stage of sample preparation, machine, time and charge. X-SEM and TEM can destroy silicon chip, and can one-time cut diagnostic area. TEM cannot work on photoetching glue. CDSEM can bring about photoetching glue to absorb charge, systole, injure photoetching glue even, CDSEM cannot provide 3D appearance information almost. Optical scattering measures measure to have mix quickly accurate characteristic, but can work on the structure of special design only, and cannot provide LER and LWR data. Be specific filmy structure to develop a reliable scattering to measure a database is special difficulty normally and time-consuming. Dimensional resolution and facula dimension are ray of meeting limitation X, optical ply, or form appearance determines the application of the instrument.
Previous12 Next
